Incorporating DSA in multipatterning semiconductor manufacturing technologies

@inproceedings{Badr2015IncorporatingDI,
  title={Incorporating DSA in multipatterning semiconductor manufacturing technologies},
  author={Yasmine Badr and J. Andres Torres and Yuansheng Ma and Joydeep Mitra and Puneet Gupta},
  year={2015}
}
Multi-patterning (MP) is the process of record for many sub-10nm process technologies. The drive to higher densities has required the use of double and triple patterning for several layers; but this increases the cost of the new processes especially for low volume products in which the mask set is a large percentage of the total cost. For that reason there has been a strong incentive to develop technologies like Directed Self Assembly (DSA), EUV or E-beam direct write to reduce the total number… CONTINUE READING

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