In situ observations of micromechanical behaviors of intermetallic compounds for structural applications in 3D IC micro joints

@article{Yu2015InSO,
  title={In situ observations of micromechanical behaviors of intermetallic compounds for structural applications in 3D IC micro joints},
  author={Jyun-Gong Yu and J. Y. Wu and Li-An Yu and C. R. Kao},
  journal={2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC)},
  year={2015},
  pages={838-841}
}
For 3D IC application, solder volume in micro joint is much smaller than in the conventional joint. IMCs can easily occupied micro joints and dominate the properties of micro joint. Thus, it is anticipated that IMCs are to be used as structural materials in commercial scale in a few years. However, mechanical property data for reliability modelling are lacking. To characterize mechanical properties of IMCs becomes an urgent issue. In this study, we investigated the micromechanical behaviors of… CONTINUE READING

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