In situ investigation of the microstructure evolution in nanocrystalline copper electrodeposits at room temperature

@inproceedings{Pantleon2006InSI,
  title={In situ investigation of the microstructure evolution in nanocrystalline copper electrodeposits at room temperature},
  author={Karen Pantleon and Marcel A. J. Somers},
  year={2006}
}
The microstructure evolution in copper electrodeposits at room temperature (self-annealing) was investigated by means of x-ray diffraction analysis and simultaneous measurements of the electrical resistivity as a function of time. In situ studies were started immediately after deposition of the various thick layers and continued with a unique time resolution until stabilization of the recorded data occurred. Independent of the copper layer thickness, the as-deposited microstructure consisted of… CONTINUE READING

Figures and Tables from this paper.

Citations

Publications citing this paper.
SHOWING 1-10 OF 11 CITATIONS

Growth and recrystallization of electroplated copper columns

  • 2009 International Conference on Electronic Packaging Technology & High Density Packaging
  • 2009
VIEW 7 EXCERPTS
CITES BACKGROUND & METHODS
HIGHLY INFLUENCED

Experimentally, how does Cu TSV diameter influence its stress state?

  • 2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
  • 2015
VIEW 1 EXCERPT
CITES BACKGROUND

Disparate tendency of stress evolution of thin and thick electroplated Cu films at room temperature

  • 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
  • 2010
VIEW 1 EXCERPT
CITES BACKGROUND

Modeling of stress evolution of electroplated Cu films during self-annealing

  • 2010 IEEE International Reliability Physics Symposium
  • 2010
VIEW 2 EXCERPTS
CITES BACKGROUND

Similar Papers