In-line wafer level hermetic packages for MEMS variable capacitor

@article{Obata2008InlineWL,
  title={In-line wafer level hermetic packages for MEMS variable capacitor},
  author={Susumu Obata and Masamichi Inoue and Takeshi Miyagi and Ikuo Mori and Yoshiaki Sugizaki and Yukiko Shimooka and Akihiro Kojima and Mitsuyoshi Endo and Hideki Shibata},
  journal={2008 58th Electronic Components and Technology Conference},
  year={2008},
  pages={158-163}
}
In this paper, we report in-line wafer level hermetic packages (WLP) for MEMS variable capacitors. The beam structure of MEMS vibrates strongly under decompression. Since this vibration causes RF noise, it is necessary to set the pressure around the beam structure at 40000Pa or greater. Therefore, a structure that carries out a resin seal of the hole for etching the cap of a formed in the sacrificial layer process, at atmospheric pressure (101300Pa) is crucial for what. To prevent moisture… CONTINUE READING