In-Service Diagnostics for Wire-Bond Lift-off and Solder Fatigue of Power Semiconductor Packages

@article{Eleffendi2017InServiceDF,
  title={In-Service Diagnostics for Wire-Bond Lift-off and Solder Fatigue of Power Semiconductor Packages},
  author={Mohd. Amir Eleffendi and Christopher Mark Johnson},
  journal={IEEE Transactions on Power Electronics},
  year={2017},
  volume={32},
  pages={7187-7198}
}
Wire-bond lift-off and Solder fatigue are degradation mechanisms that dominate the lifetime of power semiconductor packages. Although their lifetime is commonly estimated at the design stage, based on mission profiles and physics-of-failure models, there are many uncertainties associated with such lifetime estimates, emerging, e.g., from model calibration errors, manufacturing tolerances, etc. These uncertainties, combined with the diverse working environments of power semiconductor packages… CONTINUE READING

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