Improving Cu line Rs control using feed-forward information for CMP endpointing

Abstract

A promising method for controlling sheet resistance (Rs) of Cu interconnect through improved chemical mechanical planarization (CMP) endpoint capability was developed using broadband spectrometry together with feed-forward information from upstream process conditions. With this new method, the wafer-to-wafer (WTW) Rs range was reduced more than 50% compared… (More)

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