Improved Neuronal Adhesion to the Surface of Electronic Device by Engulfment of Protruding Micro-Nails Fabricated on the Chip Surface

@article{Spira2007ImprovedNA,
  title={Improved Neuronal Adhesion to the Surface of Electronic Device by Engulfment of Protruding Micro-Nails Fabricated on the Chip Surface},
  author={M. Spira and Dotan Kamber and Ada Dormann and Asher Cohen and Carmen Bartic and G. Borghs and J.P.M. Langedijk and Shlomo Yitzchaik and K. Shabthai and Joseph Shappir},
  journal={TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference},
  year={2007},
  pages={1247-1250}
}
One of the major problems in assembling efficient neuro-electronic hybrids systems is the low electrical coupling between the components. This is mainly due to the low resistance, extracellular cleft formed between the cell's plasma membrane and the substrate to which it adhere. This cleft shunts the current generated by the neuron, or the device and thus reduces the signal to noise ratio. To increase the clefts electrical resistance we fabricated gold micronails that protrude from the… CONTINUE READING
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