Improved Drop Reliability Performance with Lead Free Solders of Low Ag Content and Their Failure Modes

@article{Kim2007ImprovedDR,
  title={Improved Drop Reliability Performance with Lead Free Solders of Low Ag Content and Their Failure Modes},
  author={Hyunchul Kim and Mu Zhang and Chintan Kumar and Daewoong Suh and Pilin Liu and Dongwook Kim and Mayue Xie and Zhiyong Wang},
  journal={2007 Proceedings 57th Electronic Components and Technology Conference},
  year={2007},
  pages={962-967}
}
Solder joint reliability of lead free solders (Sn-Ag-Cu) in drop testing has been an issue in mobile and handheld electronics. Since lead free solders have lower drop performance compared with Pb-Sn solders, many efforts have been reported to improve solder joint reliability with various lead free solders. In this study, standard JEDEC drop reliability tests were performed for a CSP (chip scale package) prepared with two different compositions of lead free solders (SAC405 alloy: Sn-4Ag-0.5Cu… CONTINUE READING
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