Improved Drop Reliability Performance with Lead Free Solders of Low Ag Content and Their Failure Modes

  title={Improved Drop Reliability Performance with Lead Free Solders of Low Ag Content and Their Failure Modes},
  author={Hyunchul Kim and Mu Zhang and Chintan Kumar and Daewoong Suh and Pilin Liu and Dongwook Kim and Mayue Xie and Zhiyong Wang},
  journal={2007 Proceedings 57th Electronic Components and Technology Conference},
Solder joint reliability of lead free solders (Sn-Ag-Cu) in drop testing has been an issue in mobile and handheld electronics. Since lead free solders have lower drop performance compared with Pb-Sn solders, many efforts have been reported to improve solder joint reliability with various lead free solders. In this study, standard JEDEC drop reliability tests were performed for a CSP (chip scale package) prepared with two different compositions of lead free solders (SAC405 alloy: Sn-4Ag-0.5Cu… CONTINUE READING
Highly Cited
This paper has 55 citations. REVIEW CITATIONS


Publications citing this paper.
Showing 1-10 of 36 extracted citations

High-Speed Shear Test for Low Alpha Sn-1.0%Ag-0.5%Cu (SAC-105) Solder Ball of Sub-100-$\mu{\rm m}$ Dimension for Wafer Level Packaging

IEEE Transactions on Components, Packaging and Manufacturing Technology • 2013
View 5 Excerpts
Highly Influenced

Effect of Cu content on the interfacial reliability of SnAgCu solder joints

2010 12th Electronics Packaging Technology Conference • 2010
View 4 Excerpts
Highly Influenced

Board-Level Drop Impact Reliability of Silicon Interposer-Based 2.5-D IC Integration

IEEE Transactions on Components, Packaging and Manufacturing Technology • 2016
View 1 Excerpt

Sn–3.0Ag–0.5Cu Nanocomposite Solder Reinforced With Bi2Te3 Nanoparticles

IEEE Transactions on Components, Packaging and Manufacturing Technology • 2015
View 1 Excerpt

Thermal cycling reliability of SnAgCu solder joints in WLCSP

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) • 2014
View 2 Excerpts

Mechanical deformation behavior of SAC305 at high strain rates

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems • 2012

56 Citations

Citations per Year
Semantic Scholar estimates that this publication has 56 citations based on the available data.

See our FAQ for additional information.


Publications referenced by this paper.
Showing 1-7 of 7 references

Experimental Studies of Board-level Reliability of Chip-scale Packages Subjected to JEDEC Drop Test Condition,

Y-S. Lai. P-F. Yang, C-L. Yeh
Microelectronics Reliability, • 2006
View 2 Excerpts

Drop Impact Reliability Testing for Lead-Free and Leaded Soldered IC Packages

Proceedings Electronic Components and Technology, 2005. ECTC '05. • 2005
View 1 Excerpt

Drop reliability performance assessment for PCB assemblies of chip scale packages (CSP)

2005 7th Electronic Packaging Technology Conference • 2005
View 1 Excerpt

and J

M. Alajoki, L. Nguyen
Kivilahti, "Drop Test Reliability of Wafer Level Chip Scale Package", Proc 55th Electronics Componenst and Technology Conf, Lake Buena Vista, FL, May. • 2005
View 1 Excerpt

Effects of Ag content on Fracture Resistance of Sn-AgCu Lead-Free Solders under High-Strain Rate Conditions

D.W.D. Suh
Mat. Sci. Eng (A), in press • 1997
View 2 Excerpts

Subcritical crack growth in glasses under cyclic loads : effects of hydrodynamic pressure in aqueous environments

K. S. Yi, S. J. Dill, R. H. Dauskardt

Similar Papers

Loading similar papers…