Implementation of silicon-on-glass MEMS devices with embedded through-wafer silicon vias using the glass reflow process for wafer-level packaging and 3 D chip integration

@inproceedings{Lin2007ImplementationOS,
  title={Implementation of silicon-on-glass MEMS devices with embedded through-wafer silicon vias using the glass reflow process for wafer-level packaging and 3 D chip integration},
  author={Chiung-Wen Lin and Chia-Pao Hsu and Hsueh-An Yang and W. C. Wang and Weileun Fang},
  year={2007}
}
This study presents a novel system architecture to implement silicon-on-glass (SOG) MEMS devices on Si–glass compound substrate with embedded silicon vias. Thus, the 3D integration of MEMS devices can be accomplished by means of through-wafer silicon vias. The silicon vias connecting to the pads of devices are embedded inside the Pyrex glass. Parasitic… CONTINUE READING