Implementation of SOG devices with embedded through-wafer silicon vias using a glass reflow process for wafer-level 3D MEMS integration

@article{Lin2008ImplementationOS,
  title={Implementation of SOG devices with embedded through-wafer silicon vias using a glass reflow process for wafer-level 3D MEMS integration},
  author={Chiung-Wen Lin and Chia-Pao Hsu and Hsueh-An Yang and W. C. Wang and Weileun Fang},
  journal={2008 IEEE 21st International Conference on Micro Electro Mechanical Systems},
  year={2008},
  pages={802-805}
}
This study presents a novel system architecture to implement SOG (Silicon-on-Glass) MEMS devices on Si-glass compound substrate with embedded silicon vias. The silicon vias connecting to the pads of device are embedded inside the Pyrex glass. Parasitic capacitance for both vias and microstructures is decreased and mismatch of coefficient of thermal expansion (CTE) is reduced. In applications, the glass reflow process together with the SOG micromachining processes were employed to implement the… CONTINUE READING
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