Impact of Low k Dielectrics on Electromigration Reliability for Cu Interconnects

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@inproceedings{Ho2003ImpactOL, title={Impact of Low k Dielectrics on Electromigration Reliability for Cu Interconnects}, author={Paul S. Ho and Ki-Don Lee and Ennis T. Ogawa and Sean Hyuck Yoon and Xia Lu}, year={2003} }