Impact of Ag plated surface roughness towards die bond and wire bond

@article{Liew2013ImpactOA,
  title={Impact of Ag plated surface roughness towards die bond and wire bond},
  author={Goh Chen Liew and Khoo Ju Lee and Yeo Kian Hong and Manantan Soriano Aileen and Lim Yuan Ming},
  journal={2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)},
  year={2013},
  pages={882-886}
}
Lead delamination is one of the major challenges faced in semiconductor manufacturing. It happens when there is a separation between silver plated surface (Ag) and encapsulation molding compound (EMC) inside a package. One of the most common approach that were often used is through roughening of Ag surface to improve the mechanical interlocking between Ag surface and EMC [1]. However, the characteristic of Ag surface roughness towards die bond and wire bond performance is not studied in depth… CONTINUE READING