Illumination system for wire bonding inspection.

@article{Perng2007IlluminationSF,
  title={Illumination system for wire bonding inspection.},
  author={Der-Baau Perng and Cheng-Chuan Chou and Shu-Ming Lee},
  journal={Applied optics},
  year={2007},
  volume={46 6},
  pages={
          845-54
        }
}
A novel lighting system was devised for 3D defect inspection in the wire bonding process. Gold wires of 20 microm in diameter were bonded to connect the integrated circuit (IC) chip with the substrate. Bonding wire defects can be classified as 2D type and 3D type. The 2D-type defects include missed, shifted, or shorted wires. These defects can be inspected from a 2D top-view image of the wire. The 3D-type bonding wire defects are sagging wires, and are difficult to inspect from a 2D top-view… 
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