III-V-on-Si photonic integrated circuits realized using micro-transfer-printing

@article{Zhang2019IIIVonSiPI,
  title={III-V-on-Si photonic integrated circuits realized using micro-transfer-printing},
  author={Jing Zhang and Grigorij Muliuk and Joan Juvert and Sulakshna Kumari and Jeroen Goyvaerts and Bahawal Haq and Camiel Op de Beeck and Bart Kuyken and Geert Morthier and Dries van Thourhout and Roel Baets and Guy Lepage and Peter Verheyen and Joris Van Campenhout and Agnieszka M. Gocalinska and James O'Callaghan and Emanuele Pelucchi and Kevin Thomas and Brian Corbett and Antonio Jose Trindade and Gunther Roelkens},
  journal={APL Photonics},
  year={2019}
}
Silicon photonics (SiPh) enables compact photonic integrated circuits (PICs), showing superior performance for a wide variety of applications. Various optical functions have been demonstrated on this platform that allows for complex and powerful PICs. Nevertheless, laser source integration technologies are not yet as mature, hampering the further cost reduction of the eventual Si photonic systems-on-chip and impeding the expansion of this platform to a broader range of applications. Here, we… 
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An electrically pumped DFB laser integrated on and coupled to a silicon waveguide circuit is demonstrated by transfer printing a 40 × 970 μm2 III-V coupon, defined on aIII-V epitaxial wafer, allowing for the very efficient use of the III- V material and the massively parallel integration of these coupons on a silicon photonic integrated circuit wafer.
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