IEEE COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY SOCIETY

@inproceedings{Aschenbrenner2010IEEECP,
  title={IEEE COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY SOCIETY},
  author={Rolf Aschenbrenner and Nadine Bonda and Thomas R. Bieler and R Wright Wayne and K. J. Pearsall and G. Subbarayan and Jos{\'e} E. Schutt-Ain{\'e} and Cpmt Transactions Editor-in-Chief and Avram Bar-Cohen and Cemal Basaran and Robert Boudreau and Ifire Tech and Varaprasa Calmidi and Flavio Canavero and Andreas C. Cangellaris and K. Borrelli B. Chiang and Albert Sean Chiou and Tz-Cheng Chiu and Steven L. Dvorak and Deepak Kumar Goyal and Charan K. Gurumurthy and Lih-Tyng Hwang and Bruce C. Kim and Daniel L. Lu and Michel S. Nakhla and Ontario Canda and Luu Nguyen and John H. L. Pang and Omar M. Ramahi and Ephraim Suhir and Jilin Tan and Manos M. Tentzeris and Sandeep Tonapi and Andreas Weisshaar},
  year={2010}
}
This talk will review the soldering process, with flux and without flux, followed by solid-state bonding and flip-chip interconnects using pure silver (Ag) columns or joints. In nearly every soldering process in electronic industry, flux, acidic rosin, is used to remove oxides in order to achieve good bonding. Fluxless bonding process, that does not need flux, is made possible by proper design of bonding media and environment. The Ag-In system will be presented to demonstrate the fluxless… CONTINUE READING

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