I-BIRAS: Interconnect Built-In Self-Repair and Adaptive Serialization in 3D Integrated Systems

@article{Nicolaidis2011IBIRASIB,
  title={I-BIRAS: Interconnect Built-In Self-Repair and Adaptive Serialization in 3D Integrated Systems},
  author={Michael Nicolaidis and Vladimir Pasca and Lorena Anghel},
  journal={2011 Sixteenth IEEE European Test Symposium},
  year={2011},
  pages={208-208}
}
In 3D integrated systems, Thru-Silicon-Vias (TSVs) enable higher performance and energy efficiency, by reducing the data travel distances. However, the TSV manufacturing and wear-out defect rates lead to poor interconnect reliability and yield. The high fault rates and TSV footprint make spare-based repair solutions inefficient. I-BIRAS combines self-repair and adaptive serialization to increase yield and circuit life at the cost of lower throughput. After the interconnect test, the diagnosis… CONTINUE READING