Hybrid silicon photonics flip-chip laser integration with vertical self-alignment

@article{MoscosoMx00E1rtir2017HybridSP,
  title={Hybrid silicon photonics flip-chip laser integration with vertical self-alignment},
  author={A. Moscoso-Mx00E1rtir and Florian Merget and Juliana Mueller and Johannes Hauck and S. Romero-Garcx00EDa and Bin Shen and Francois Lelarge and Romain Brenot and Alexandre Garreau and Elad Mentovich and Anna Sandomirsky and Avner Badihi and Daniel E Rasmussen and Rony Setter and Jeremy Witzens},
  journal={2017 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR)},
  year={2017},
  pages={1-4}
}
We present a flip-chip integration process in which the vertical alignment is guaranteed by a mechanical contact between pedestals defined in a recess etched into a silicon photonics chip and a laser or semiconductor optical amplifier. By selectively etching up to the active region of the III-V materials, we can make the accuracy of vertical alignment… CONTINUE READING