Hybrid Large-Signal/Lumped-Element Electro-Thermal Modeling of GaN-HEMTs

Abstract

This paper shows a practical approach to GaN-based HEMT self-consistent electro-thermal simulation for circuit modeling and reliability estimation. A physical-level lumped element dynamic thermal network able to describe the 2-D device geometry is self-consistently coupled with a novel electro-thermal compact large-signal model. The results obtained with… (More)

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