How to evaluate transient dual interface measurements of the Rth-JC of power semiconductor packages

Abstract

The standard procedure to measure the Rth-JC of semiconductor devices requires a thermocouple measurement of the case temperature while the IC-package is in contact with a water-cooled heat-sink. This method often produces wrong results since the measurement of the case temperature is quite prone to errors. Transient dual interface (TDI) measurements have… (More)

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