Hotspot thermal management via thin-film evaporation


The emerging three-dimensional vertical chip stacking architecture is expected to reduce form factor and improve performance by providing energy efficient chip design. However, increased power density and non-uniform heat generation in stacked dies offset its advantages and pose a significant thermal management challenge by creating hotspots where heat… (More)

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@article{Adera2016HotspotTM, title={Hotspot thermal management via thin-film evaporation}, author={Solomon Adera and Dion Savio Antao and Rishi Raj and Evelyn N Wang}, journal={2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)}, year={2016}, pages={364-371} }