HotSpot: a compact thermal modeling methodology for early-stage VLSI design

@article{Huang2006HotSpotAC,
  title={HotSpot: a compact thermal modeling methodology for early-stage VLSI design},
  author={Wei Huang and Shougata Ghosh and Sivakumar Velusamy and Karthik Sankaranarayanan and Kevin Skadron and Mircea R. Stan},
  journal={IEEE Transactions on Very Large Scale Integration (VLSI) Systems},
  year={2006},
  volume={14},
  pages={501-513}
}
This paper presents HotSpot-a modeling methodology for developing compact thermal models based on the popular stacked-layer packaging scheme in modern very large-scale integration systems. In addition to modeling silicon and packaging layers, HotSpot includes a high-level on-chip interconnect self-heating power and thermal model such that the thermal impacts on interconnects can also be considered during early design stages. The HotSpot compact thermal modeling approach is especially well… CONTINUE READING

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