Hot spot mitigation using single-phase microchannel cooling for microprocessors

Abstract

The placement and arrangement of the different components on a microprocessor chip is examined to mitigate the hot spots that may arise on the device during its operation. The power dissipation of the individual components on a microprocessor is spatially and temporally non-uniform, possibly resulting in high thermal gradients and, as a consequence, high… (More)

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Cite this paper

@article{Chauhan2010HotSM, title={Hot spot mitigation using single-phase microchannel cooling for microprocessors}, author={Anjali Chauhan and B. G. Sammakia and Kanad Ghose and Gamal Refai-Ahmed and Dereje Agonafer}, journal={2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems}, year={2010}, pages={1-11} }