Hot Solder Dip and Minimizing Thermal Gradients

@inproceedings{Winslow2006HotSD,
  title={Hot Solder Dip and Minimizing Thermal Gradients},
  author={Russell T. Winslow and Ganesh R. Iyer and M Margarida Cruz and Guna S. Selvaduray and Montague Expressway Milpitas},
  year={2006}
}
The semiconductor industry’s move to pure-tin finishes is creating a dilemma for the high-reliability community. Most military and aerospace companies forbid the use of pure-tin because of the risk of tin whiskers. To resolve this dilemma, hot solder dip is being implemented to convert components to alternative finishes. However, poorly designed solder dip temperature profiles can induce severe thermal gradients within components, which can cause acute and/or latent defects. This paper… CONTINUE READING

References

Publications referenced by this paper.
Showing 1-7 of 7 references

Apr.). Tin Whiskers: A History of Documented Electrical System Failures. Space Shuttle Program Office, Greenbelt, MD

  • H. Leidecker, J. Brusse
  • http://nepp.nasa.gov/whisker/
  • 2006
1 Excerpt

Development, Validation and Application of a Thermal Model of a Plastic Quad Flat Pack. Flomerics

  • H. I. Rosten, J. D. Parry, J. S. Addison, R. Viswanath, M. Davies, E. Fitzgerald
  • 2006
1 Excerpt

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

  • N. C. Lee
  • Massachusetts: Newnes Press, 2002, p. 78.
  • 2002
1 Excerpt

Fundamentals of Engineering Heat and Mass Transfer

  • R. C. Sachdeva
  • New Delhi, India: New Age International, 1996, pp…
  • 1996
1 Excerpt

Soldering in Electronics

  • R. J. Klein Wassink
  • 2nd ed., Scotland: Electrochemical Publications…
  • 1989
1 Excerpt

Influence of Temperature on Microelectronics and System reliability

  • P. Lall, M. G. Pecht, E. B. Hakim
  • Maryland: CRC Press, LLC, p. 121.
1 Excerpt

Partial Guideline for the Use of Robotic Solder Dipping to Replace Component Surface Finishes of Pure Tin with an Immersion Tin-Lead Finish

  • W. P. Rollins
  • Navy TMTI Robotic Solder Dip Project (unpublished…
1 Excerpt

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