Hot Solder Dip and Minimizing Thermal Gradients

  title={Hot Solder Dip and Minimizing Thermal Gradients},
  author={Russell T. Winslow and Ganesh R. Iyer and M Margarida Cruz and Guna S. Selvaduray and Montague Expressway Milpitas},
The semiconductor industry’s move to pure-tin finishes is creating a dilemma for the high-reliability community. Most military and aerospace companies forbid the use of pure-tin because of the risk of tin whiskers. To resolve this dilemma, hot solder dip is being implemented to convert components to alternative finishes. However, poorly designed solder dip temperature profiles can induce severe thermal gradients within components, which can cause acute and/or latent defects. This paper… CONTINUE READING


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