Homogenization of TSV interposer and quick assessment of its thermomechanical influence on 3D packages

@article{Chen2013HomogenizationOT,
  title={Homogenization of TSV interposer and quick assessment of its thermomechanical influence on 3D packages},
  author={C. F. Chen},
  journal={2013 IEEE 63rd Electronic Components and Technology Conference},
  year={2013},
  pages={2249-2254}
}
  • C. F. Chen
  • Published 2013 in
    2013 IEEE 63rd Electronic Components and…
Thin and filled with the through-silicon cupper via (TSV) array, silicon interposers are key to vertical integration of chips for denser packaging. TSVs reduce the trace length by directing electrons vertically through stacks of chips, so better electrical performance with less power consumption is made feasible. The via-enriched silicon interposer, albeit thin, can also serve as a stress buffer to mechanically modulate stresses among the components. In this regard, the effectiveness of being a… CONTINUE READING