High throughput thermo-compression bonding with pre-applied underfill for 3D memory applications

@article{Lim2016HighTT,
  title={High throughput thermo-compression bonding with pre-applied underfill for 3D memory applications},
  author={Adeline B. Y. Lim and Alireza Rezvani and Ryjean Datinguinoo Bacay and Tom Colosimo and Oranna Yauw and Horst Clauberg and Bob Chylak},
  journal={2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)},
  year={2016},
  pages={427-434}
}
  • A. B. Lim, A. Rezvani, +4 authors B. Chylak
  • Published 1 November 2016
  • Materials Science
  • 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)
As demand for smaller and faster electronic products increases rapidly, 3D packaging with higher electrical performance and density are desirable [1]. Flip chip interconnection technologies using copper pillars have been widely used in many microelectronic applications for high performance systems as well as consumer electronics in recent years [2]. The technology offers improved electrical and thermal performance due to shorter electrical paths between die and substrate. Memory applications… 
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