High throughput thermal compression NCF bonding

@article{Nonaka2014HighTT,
  title={High throughput thermal compression NCF bonding},
  author={Toshihisa Nonaka and Yuta Kobayashi and Noboru Asahi and Shoichi Niizeki and Koichi Fujimaru and Yoshiyuki Arai and Toshifumi Takegami and Yoshinori Miyamoto and Masatsugu Nimura and Hiroyuki Niwa},
  journal={2014 IEEE 64th Electronic Components and Technology Conference (ECTC)},
  year={2014},
  pages={913-918}
}
High through put thermal compression NCF bonding was studied and the new process consisting of dividing pre and main bonding, and the multi die gang main bonding has been developed. The dividing could change the process from serial to parallel and enabled to use the constant heated bonder head, which eliminated the time consuming head cooling process of the conventional serial thermal compression bonding. The die of 7.3 × 7.3 × 0.1 mm size with bumps of 38 × 38 μm2 square Cu pillar covered by… CONTINUE READING

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