High thermal conductivity underfill study for fine pitch Cu pillar bump

@article{Huang2013HighTC,
  title={High thermal conductivity underfill study for fine pitch Cu pillar bump},
  author={Huei-Nuan Huang and Mei-Chin Lee and C. C. Yeh and Pai-Yuan Lee and Mu-Hsuan Chan and Chun-Tang Lin and Steve Chiu and Mike Ma},
  journal={2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)},
  year={2013},
  pages={338-340}
}
Along with the die size of device become more and more small, fine pitch, fine gap and multi-stacking are the market mainstream which applied for high performance system in advance technology, su ch as 3D IC. Th erefore, h eat dissipation is must process for this kind of electronic device to avoid internal heating form device during operate. Un derfill (UF… CONTINUE READING