High temperature reliability on automotive power modules verified by power cycling tests up to 150degreeC

@article{Coquery2003HighTR,
  title={High temperature reliability on automotive power modules verified by power cycling tests up to 150degreeC},
  author={Gerard Coquery and Guy Lefranc and T. Licht and Richard Lallemand and Norbert Seliger and H. Berg},
  journal={Microelectronics Reliability},
  year={2003},
  volume={43},
  pages={1871-1876}
}
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