High temperature behaviour and reliability of Al-Ribbon for automotive applications

@article{Milke2008HighTB,
  title={High temperature behaviour and reliability of Al-Ribbon for automotive applications},
  author={Eugen Milke and Tim Mueller},
  journal={2008 2nd Electronics System-Integration Technology Conference},
  year={2008},
  pages={417-422}
}
Within the last years the bonding wire market is moving to ultra fine wires below 23 mum. Leading edge applications are now using 18 mum in mass production. This tendency is shown and predicted by the annual semiconductor industry roadmaps for IC/ASIC packaging. Special focus is on cost reduction and a continued decreasing of the package size. Contrary, the development in packaging of power devices is heading the opposite way to accommodate larger aluminium wires with multiple stitches… CONTINUE READING
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