High speed laser processing for monolithical series connection of silicon thin‐film modules

@inproceedings{Haas2008HighSL,
  title={High speed laser processing for monolithical series connection of silicon thin‐film modules},
  author={Stefan Haas and Aad Gordijn and Helmut Stiebig},
  year={2008}
}
A detailed analysis of the monolithical series connection of silicon thin-film modules with metal back contact fabricated by high-speed laser ablation will be presented. In this study, optically pumped solid-state lasers with wavelengths of 1064 nm and 532 nm were used for the patterning process. The influence of various laser parameters on the performance of amorphous and microcrystalline silicon modules will be discussed. In particular, the line-scribing parameters for a TCO and Ag back… CONTINUE READING

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