High-speed high-accuracy fiber optic low-coherence interferometry for in situ grinding and etching process monitoring

  title={High-speed high-accuracy fiber optic low-coherence interferometry for in situ grinding and etching process monitoring},
  author={Wojciech J. Walecki and A. Pravdivtsev and Manuel {\'A}vila Santos and Ann Koo},
  booktitle={SPIE Optics + Photonics},
We present design of novel tool for characterization of wafer thickness and wafer topography employing fast low coherence fiber optic interferometer, which optical length of the reference arm of the interferometer is monitored by secondary long coherence length interferometer. 
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Stacked-die Packaging: Technology Toolbox, Step 8
  • Advanced Packaging August,
  • 2004
Wafer Thinning: Techniques for Ultra-thin Wafers
  • Advanced Packaging March,
  • 2003
Wafer Thinning: Techniques for Ultra-thin Wafers
  • Advanced Packaging March,
  • 2003
Karnezos “ Stacked - die Packaging : Technology Toolbox , Step 8