High-res 3D X-ray microscopy for non-destructive failure analysis of chip-to-chip micro-bump interconnects in stacked die packages

@article{Zulkifli2017Highres3X,
  title={High-res 3D X-ray microscopy for non-destructive failure analysis of chip-to-chip micro-bump interconnects in stacked die packages},
  author={Syahirah Md Zulkifli and Bemice Zee and Wen Qiu and Allen Gu},
  journal={2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)},
  year={2017},
  pages={1-5}
}
Novel 3D architecture of electronics packages raises immense challenges for electrical fault isolation and physical failure analysis (PFA). This paper describes a streamlined workflow involving 3D X-ray Microscopy (XRM) to effectively bridge fault isolation and physical failure analysis (PFA). The case studies on chip-to-chip micro-bump interconnecting failure will be discussed. X-ray microscopy improved the efficiency and efficacy of failure analysis (FA) by non-destructively imaging and… CONTINUE READING
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An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components

  • M. Yazdan Mehr
  • 2015 16th International Conference on Thermal…
  • 2015
2 Excerpts

The ascent of 3D X-ray microscopy in the laboratory.

  • A. Merkle, J. Gelb
  • Microscopy Today
  • 2013
1 Excerpt

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