High-precision and versatile optical measurement of different sides of ICs in the confectioning process using only one viewpoint

@article{Stanke1998HighprecisionAV,
  title={High-precision and versatile optical measurement of different sides of ICs in the confectioning process using only one viewpoint},
  author={G. Stanke and T. Wohrle and Frank-Peter Schilling},
  journal={IECON '98. Proceedings of the 24th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.98CH36200)},
  year={1998},
  volume={4},
  pages={2425-2427 vol.4}
}
Quality checking and part measurement are well established procedures in manufacturing processes. There are requirements for complete part inspections e.g. in the manufacturing process of SMD devices. To check coplanarity of pins on all chip sides is such a requirement. The paper refers a solution allowing to perform the contactless inspection task for all four chip sides from one point of view. The required accuracy is reached by a special subpixel approach. For a test set, the comparison to a… CONTINUE READING

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