High density, aspect ratio through-wafer electrical interconnect vias for low cost, generic modular MEMS packaging

@article{Ok2002HighDA,
  title={High density, aspect ratio through-wafer electrical interconnect vias for low cost, generic modular MEMS packaging},
  author={Seong Joon Ok and Daniel Flanagan Baldwin},
  journal={2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617)},
  year={2002},
  pages={8-11}
}
The commercialization of Micro-Electro-Mechanical-Systems (MEMS) devices is hindered mainly due to association of high cost and inadequate solution of packaging. This paper outlines the current microsystem packaging challenges, and guides potential solutions for these problems. Low cost, generic and modular microsystem packaging designs are introduced, and the focus is on fabrication of high-density, aspect ratio through-wafer vias for electrical interconnect. In modern microsystem packaging… CONTINUE READING

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