High-cycle fatigue life prediction for Pb-free BGA under random vibration loading

  title={High-cycle fatigue life prediction for Pb-free BGA under random vibration loading},
  author={Da Yu and Abdullah Al-Yafawi and Tung T. Nguyen and Seungbae Park and Soonwan Chung},
  journal={Microelectronics Reliability},
This paper develops an assessment methodology based on vibration tests and finite element analysis (FEA) to predict the fatigue life of electronic components under random vibration loading. A specially designed PCB with ball grid array (BGA) packages attached was mounted to the electro-dynamic shaker and was subjected to different vibration excitations at the supports. An event detector monitored the resistance of the daisy chained circuits and recorded the failure time of the electronic… CONTINUE READING
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