High cycle fatigue behaviour and generalized fatigue model development of lead-free solder alloy based on local stress approach

@article{Thambi2016HighCF,
  title={High cycle fatigue behaviour and generalized fatigue model development of lead-free solder alloy based on local stress approach},
  author={J. Thambi and U. Tetzlaff and Andreas Schiessl and K. D. Lang and M. Waltz},
  journal={Microelectronics Reliability},
  year={2016},
  volume={66},
  pages={98-105}
}
Abstract This paper gives an insight into high cycle fatigue (HCF) behaviour of a Pb-free solder alloy in the region between 10 4 up to 10 9 fatigue cycles using fatigue specimen. By means of a local stress approach, the method can be translated into solder joint fatigue evaluation in an application. The effect of temperatures (35 °C, 80 °C, 125 °C) on the fatigue property of Pb-free solder alloy is considered in this work to understand the possible fracture mechanisms and micro structural… CONTINUE READING

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  • 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
  • 2018
VIEW 1 EXCERPT
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References

Publications referenced by this paper.
SHOWING 1-10 OF 28 REFERENCES

S

R. Metasch, J. C. Boareto, M. Roellig
  • Wiese, K.-J. Wolter, Primary and tertiary creep properties of eutectic SnAg3.8Cu0.7 in bulk specimens, EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, April 2009, http://dx.doi.org/10. 1109/esime.
  • 2016
VIEW 5 EXCERPTS
HIGHLY INFLUENTIAL

FKM Guideline - Analytical Strength Assessment of Components in Mechanical Engineering

E. Haibach
  • 5th edition VDMA Verlag, Frankfurt
  • 2003
VIEW 7 EXCERPTS
HIGHLY INFLUENTIAL

Fatigue and fracture

VIEW 3 EXCERPTS
HIGHLY INFLUENTIAL

Study of thermal cycling and temperature aging on PbSnAg die attach solder joints for high power modules

  • 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits
  • 2014

Lifetime assessment for bipolar components under vibration and temperature loading

  • 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
  • 2013
VIEW 1 EXCERPT

S

M. Guo, S. Bhosale
  • Srikantan, K.Munson, J. Mentley, A fatigue life estimation technique for body mount joints, SAE Int. J. Mater. Manf. 5 (1)
  • 2012