High-Quality Tungsten Films by Hotwire-Assisted CVD / ALD at Low Temperature

@inproceedings{Kovalgin2016HighQualityTF,
  title={High-Quality Tungsten Films by Hotwire-Assisted CVD / ALD at Low Temperature},
  author={Alexey Y. Kovalgin},
  year={2016}
}
There is a growing interest in atomic layer deposition (ALD) of metals for ultra-large-scale integrated circuit (ULSIC) manufacturing. Radical-enhanced ALD (REALD) utilizing plasma (PEALD) has been proposed to grow a number of metals [1]. In our work, we investigate an alternative approach to REALD without plasma, i.e. replacing plasma by a hot (up to 2000… CONTINUE READING