High-Precision Flip-Chip Process Yields E-Band Harmonic Mixers with Potential Sub-10-dB Conversion Loss

@article{Stoneham2006HighPrecisionFP,
  title={High-Precision Flip-Chip Process Yields E-Band Harmonic Mixers with Potential Sub-10-dB Conversion Loss},
  author={E. Stoneham},
  journal={2006 European Microwave Conference},
  year={2006},
  pages={506-509}
}
  • E. Stoneham
  • Published 2006 in 2006 European Microwave Conference
A process in which discrete semiconductor chips are flip-attached by thermocompression bonding to 30-micron-diameter gold bumps on fine-featured passive integrated circuits was employed in the fabrication of diode subharmonic mixers for use over the 71-76 GHz and 81-86 GHz ranges. Incorporated in the substrate were high-precision grounded heat sinks, semi… CONTINUE READING