High-Frequency Characterization of Through-Silicon-Vias With Benzocyclobutene Liners

@article{Wu2017HighFrequencyCO,
  title={High-Frequency Characterization of Through-Silicon-Vias With Benzocyclobutene Liners},
  author={Ke Wu and Zheyao Wang},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology},
  year={2017},
  volume={7},
  pages={1859-1868}
}
  • Ke Wu, Zheyao Wang
  • Published 2017 in
    IEEE Transactions on Components, Packaging and…
This paper presents design, fabrication, and high-frequency characterization of through-silicon-vias (TSVs) with benzocyclobutene (BCB) as the dielectric liner to exploit its low dielectric constant. Fabrication processes for BCB polymer liner TSVs are developed, and BCB-liner TSVs have been successfully fabricated in both low-resistivity silicon and high-resistivity silicon substrates for comparison. A de-embedding method that enables extraction of S-parameters from cascade TSV chains is… CONTINUE READING
0 Citations
47 References
Similar Papers

References

Publications referenced by this paper.
Showing 1-10 of 47 references

Electromagnetic characteristics of multiport TSVs using L-2L de-embedding method and shielding TSVs

  • Y.-S. Li
  • IEEE Trans. Electromagn. Compat., vol. 59, no. 5…
  • 2017
1 Excerpt

Similar Papers

Loading similar papers…