High-Frequency Characterization of Through-Silicon-Vias With Benzocyclobutene Liners

  title={High-Frequency Characterization of Through-Silicon-Vias With Benzocyclobutene Liners},
  author={Ke Wu and Zheyao Wang},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology},
  • Ke Wu, Zheyao Wang
  • Published 2017 in
    IEEE Transactions on Components, Packaging and…
This paper presents design, fabrication, and high-frequency characterization of through-silicon-vias (TSVs) with benzocyclobutene (BCB) as the dielectric liner to exploit its low dielectric constant. Fabrication processes for BCB polymer liner TSVs are developed, and BCB-liner TSVs have been successfully fabricated in both low-resistivity silicon and high-resistivity silicon substrates for comparison. A de-embedding method that enables extraction of S-parameters from cascade TSV chains is… CONTINUE READING
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