High-Efficiency Silicon-Based Envelope-Tracking Power Amplifier Design With Envelope Shaping for Broadband Wireless Applications

@article{Wu2013HighEfficiencySE,
  title={High-Efficiency Silicon-Based Envelope-Tracking Power Amplifier Design With Envelope Shaping for Broadband Wireless Applications},
  author={Ruili Wu and Yen-Ting Liu and Jerry Lopez and Cliff Schecht and Yan Li and Donald Y. C. Lie},
  journal={IEEE Journal of Solid-State Circuits},
  year={2013},
  volume={48},
  pages={2030-2040}
}
This paper presents a highly efficient silicon-based envelope-tracking power amplifier (ET-PA) for broadband wireless applications. A pseudo-differential power amplifier (PA) is designed using two integrated SiGe power cells fabricated in a 0.35- μm SiGe BiCMOS technology with through-silicon-via (TSV). In the continuous-wave (CW) measurement, the PA achieves a saturated output power (POUT) of around 2 W with power-added efficiency (PAE) above 65% across the bandwidth of 0.7-1.0 GHz. To… CONTINUE READING

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