High-Density 3-D Interconnect of Cu–Cu Contacts With Enhanced Contact Resistance by Self-Assembled Monolayer (SAM) Passivation

Self-assembled monolayer (SAM) of alkane-thiol is applied on Cu damascene structures with the aim to protect the surface against contamination and oxidation prior to bonding. Three-dimensional interconnects are realized with bumpless Cu-to-Cu thermocompression bonding by wafer-on-wafer stacking. Based on cross-bar Kelvin structure measurements, up to a 17.3… CONTINUE READING