High Current Voltage Regulator Module Employs Novel Packaging Technology to Achieve Over 100 A in a Compact Footprint to Power Next Generation Servers

@inproceedings{Blake2002HighCV,
  title={High Current Voltage Regulator Module Employs Novel Packaging Technology to Achieve Over 100 A in a Compact Footprint to Power Next Generation Servers},
  author={Chris Blake and Ralph Gerard Monteiro and Andrew Sawle and Ed.C.De Segundo},
  year={2002}
}
The benefits of the first surface mount package optimized for dual sided cooling will be discussed as they apply to advanced voltage regulator module (VRM) design. A VRM will be designed using this new surface mount packaging technology for power MOSFETs, and shown to deliver the highest current in a compact footprint to meet the needs of next generation GHz class processors. 

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