Hierarchically nested channels for fast squeezing interfaces with reduced thermal resistance [IC cooling applications]

@article{Brunschwiler2005HierarchicallyNC,
  title={Hierarchically nested channels for fast squeezing interfaces with reduced thermal resistance [IC cooling applications]},
  author={Thomas Brunschwiler and Urs Kloter and R. Linderman and H. E. Rothuizen and Bruno Michel},
  journal={Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.},
  year={2005},
  pages={31-38}
}
We report a simple method to improve bondline formation kinetics by means of a hierarchical set of channels patterned into one of the surfaces. These channel arrays are used to improve the gap squeezing and cooling of single and multiple flip chip electronic modules with highly viscous fluids and thermal pastes. They allow a fast formation of thin gaps or bond lines by reducing the pressure gradient in the thermal interface material as it moves in and out of the gap. Models describing the… CONTINUE READING
1 Citations
18 References
Similar Papers

References

Publications referenced by this paper.
Showing 1-10 of 18 references

Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-laden Polymeric Thermal Interface Material on Particle Volume Fraction

  • R. S. Prasher, P. Koning, J. Shipley, A. Devpura
  • Trans. ASME 125,
  • 2003
Highly Influential
5 Excerpts

Optimization of Thermal Interface Materials for Electronics Cooling Applications

  • V. Singhal, T. Siegmund, S. V. Garimella
  • IEEE Tans. Comp. Packag. Technol
  • 2004
1 Excerpt

Design, Assembly, and Commissioning of a Test Apparatus for Characterizing Thermal Interface Materials

  • J. R. Culham, P. Teerstra, I. Savija, M. M. Yovanovich
  • IEEE 2002 Inter Society Conference on Thermal…
  • 2003
1 Excerpt

The Urgent Need for Widely Accepted Test Methods for Thermal Interface Materials

  • C.J.M. Lasance
  • IEEE SEMI-THERM Symposium,
  • 2003
1 Excerpt

Thermal resistance of particle laden polymeric thermal interface materials

  • R. S. Prasher, J. Shipley, S. Prstic, P. Koning, J. L. Wang
  • Trans. ASME 125,
  • 2003
1 Excerpt

Gap-reduced Thermal Paste Package Design for Cooling Single FlipChip Electronic Modules

  • K. K. Sikka, H. T. Toy, D. L. Edwards, S. Iruvanti, E. M. Ingalls, P. W. DeHaven
  • Inter Society Conferences on Thermal Phenomena,
  • 2002
1 Excerpt

Measuring Interface Thermal Resistance Values by Transient Testing

  • M. Rencz, V. Szekely, G. Farkas, B. Courtois
  • Inter Society Conference on Thermal Phenomena,
  • 2002
1 Excerpt

Using Cap-Integral Standoffs to Reduce Chip Hot-Spot Temperatures in Electronic Packages

  • M. S. June, K. K. Sikka
  • Inter Society Conferences on Thermal Phenomena,
  • 2002
1 Excerpt

Similar Papers

Loading similar papers…