Hierarchical three-dimensional layer-by-layer assembly of carbon nanotube wafers for integrated nanoelectronic devices.

Abstract

We report a general approach to overcome the enormous obstacle of the integration of CNTs into devices by bonding single-walled carbon nanotubes (SWNTs) films to arbitrary substrates and transferring them into densified and lithographically processable "CNT wafers". Our approach allows hierarchical layer-by-layer assembly of SWNTs into organized three-dimensional structures, for example, bidirectional islands, crossbar arrays with and without contacts on Si, and flexible substrates. These organized SWNT structures can be integrated with low-power resistive random-access memory.

DOI: 10.1021/nl3016472

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Cite this paper

@article{Yamada2012HierarchicalTL, title={Hierarchical three-dimensional layer-by-layer assembly of carbon nanotube wafers for integrated nanoelectronic devices.}, author={Takeo Yamada and Natsumi Makiomoto and Atsuko Sekiguchi and Yuki Yamamoto and Kazufumi Kobashi and Yuhei Hayamizu and Yoshiki Yomogida and Hiroyuki Tanaka and Hisashi Shima and Hiroyuki Akinaga and Don N. Futaba and Kenji Hata}, journal={Nano letters}, year={2012}, volume={12 9}, pages={4540-5} }