Heterogenous integration of III-V MMIC and Si CMOS

@article{Wu2017HeterogenousIO,
  title={Heterogenous integration of III-V MMIC and Si CMOS},
  author={Lishu Wu and Yuechan Kong and Wei Cheng and Youtao Zhang and Tangsheng Chen},
  journal={2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)},
  year={2017},
  pages={1-3}
}
In this work, we demonstrate the wafer-scale heterogeneous integration of III-V MMIC and Silicon complementary metal oxide semiconductor (Si CMOS) on the same Silicon substrate based on epitaxial layer transfer technique, III-V Compound semiconductor devices are vertical stacked at the top of the Si CMOS wafer using wafer bonding technique. Meanwhile, we exhibit a wide band GaAs digital controlled switch circuit and InP HBT quantizing chip with 1:16 demultiplexer as examples, which shows the… CONTINUE READING

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