Heterogeneous wafer reconstruction and wafer level hybridization by copper direct bonding for Infrared imagers


The manufacturing technology of Infrared imagers suffers since the beginning of a lack of competitiveness compared to the Silicon based manufacturing technologies (wafer sizes, yield, volumes produced...). A special care is needed for the manipulation of wafers which are more fragile than Silicon due to their metallurgical composition. The mass, greater… (More)


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