Heterogeneous integration of microscale compound semiconductor devices by micro-transfer-printing

@article{Bower2015HeterogeneousIO,
  title={Heterogeneous integration of microscale compound semiconductor devices by micro-transfer-printing},
  author={Christopher Andrew Bower and Matthew A. Meitl and Salvatore Bonafede and David Gomez},
  journal={2015 IEEE 65th Electronic Components and Technology Conference (ECTC)},
  year={2015},
  pages={963-967}
}
Integrating microscale electronic devices onto non-native substrates enables new kinds of products with desirable functionalities and cost structures that are inaccessible by conventional means. Micro assembly technologies are the practical ways to make such microscale heterogeneous device combinations possible. Elastomer stamp micro-transferprinting technology (μTP) is a widely-demonstrated form of micro assembly, having demonstrated applicability in optical communications, magnetic storage… CONTINUE READING

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