Hermal cycling reliability of snagcu and snpb solder joints: a comparison for several ic-packages

@article{Vandevelde2004HermalCR,
  title={Hermal cycling reliability of snagcu and snpb solder joints: a comparison for several ic-packages},
  author={Bart Vandevelde and Mario Gonzalez and Paresh Limaye and Petar Ratchev and Eric Beyne},
  journal={5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the},
  year={2004},
  pages={565-570}
}
  • B. Vandevelde, Mario Gonzalez, +2 authors E. Beyne
  • Published 1 February 2007
  • Computer Science, Materials Science
  • 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the
This paper deals with a comparison study between SnPb and SnAgCu solder joint reliability. The comparison is based on non-linear finite element modellin. Three packages have been selected: silicon CSP, underfilled flip chip and QFN package. Also the effect of thermal cycling conditions has been investigated. Comparing the induced inelastic strains in the solder joint, the leadfree SnAgCu generally scores better thanks to the lower creep strain rate. On the other hand for the CSP and flip chip… Expand
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References

SHOWING 1-10 OF 21 REFERENCES
Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation
In recent years, many solder fatigue models have been developed to predict the fatigue life of solder joints under thermal cycle conditions. While a variety of life prediction models have beenExpand
Microstructural dependence of constitutive properties of eutectic SnAg and SnAgCu solders
The paper presents constitutive models for eutectic SnAg and SnAgCu solders. Experimental investigations were carried out on specimens of different microstructures. The three specimen types have beenExpand
Reliability and failure analysis of Sn-Ag-Cu solder interconnections for PSGA packages on Ni/Au surface finish
The reliability and failure modes of eutectic Sn-Ag-Cu solder joints were studied and compared to eutectic Sn-Pb-Ag ones. Two different failure modes occur: brittle fracture and fatigue. The resultsExpand
Semi-analytical model for calculation of induced strains in solder joints of underfilled flip chip assemblies
In this paper, a simple but very practical analytical model is presented to calculate the induced strains in the solder joints of underfilled flip chip assemblies. This model is only a roughExpand
Constitutive relations for tin-based-solder joints
Extensive data on 62Sn36Pb2Ag, 60Sn40Pb, 96.5Sn3.5Ag, 97.5Pb2.5Sn, and 95Pb5Sn solder are presented. All of the data were collected on soldered assemblies to properly account for the effects of grainExpand
Solder parameter sensitivity for CSP life-time prediction using simulation-based optimization method
Finite element modeling (FEM) is widely used for estimating the solder joint reliability of electronic packages. However, the solder properties are strongly process and geometry dependent. Even forExpand
Solder parameter sensitivity for CSP life-time prediction using simulation-based optimization method
Finite element modelling is widely used for estimating the solder joint reliability of electronic packages. However, the solder properties are strong process and geometry dependent. Even for the sameExpand
Modeling and characterization of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualification
We characterize the polymer stud grid array (PSGA) package electrically, thermally and thermo-mechanically for successful commercial application. For the electrical characterization, we extractExpand
Modelling and characterisation of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualification
We characterise the polymer stud grid array (PSGA) package electrically, thermally and thermomechanically for successful commercial application. For the electrical characterisation, we extract lumpedExpand
Dependence of Constitutive Properties of Eutectic SnAg and SnAgCu Solders, proceedings of the 53rd Electronic Components and Technology
  • 2003
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