Heat transfer in microchannels: substrate effects and cooling efficiency for rectangular and circular ducts

@article{Dogruoz2010HeatTI,
  title={Heat transfer in microchannels: substrate effects and cooling efficiency for rectangular and circular ducts},
  author={M. Baris Dogruoz and Mehmet Arik and Adam G. Pautsch},
  journal={2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems},
  year={2010},
  pages={1-7}
}
Recent advances in electronics lead to smaller sizes and higher heat generation rates. Heat removal at a very tight thermal envelope is only possible with liquid cooling technologies such as the microchannel heat sink cooling. While a large number of studies have focused on experimental analysis, there is a limited number of computational data to understand the interaction between flow, material properties and geometric variables. Therefore, a computational study is performed to examine the… CONTINUE READING

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References

Publications referenced by this paper.
Showing 1-9 of 9 references

Integral micro-channel liquid cooling for power electronics

2010 Twenty-Fifth Annual IEEE Applied Power Electronics Conference and Exposition (APEC) • 2010
View 2 Excerpts

On the Conduction and Convection Heat Transfer From Lightweight Advanced Heat Sinks

IEEE Transactions on Components and Packaging Technologies • 2010
View 1 Excerpt

Micro-channel thermal management of high power devices

Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06. • 2006

and R

S. A. Solovitz, L. D. Stevanovic
A. Beaupre, ―Micro-channel Thermal Management of High Power Devices,‖ Proc. IEEE Applied Power Electronics Conference, APEC, pp. 885-891 • 2006
View 1 Excerpt

Muzychka, ―Constructal Design of Forced Convection Cooled Microchannel Heat Sinks and Heat Exchangers,

Y S.
International Journal of Heat and Mass Transfer, • 2005
View 1 Excerpt

Fundamentals of Heat and Mass Transfer

F. P. Incropera, D. P. DeWitt
4 th Edition, New York, NY • 1996

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