Heat-resistance study of thermal release tape

@article{Chi2013HeatresistanceSO,
  title={Heat-resistance study of thermal release tape},
  author={Chieh-Yuan Chi and Chun-Tang Lin and Jung-Pang Huang and Mu-Hsuan Chan and Yan-Yi Liao and Yan-heng Chen and Wei-yu Chen},
  journal={2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)},
  year={2013},
  pages={35-38}
}
Thermal release tape is an unique tape that has three layers structure, including adhesive layer - base film and thermal release layer. These tapes behave like adhesive tape at room temperature but can be easily removed by heating at high temperature when we want to release this tape[1, 2]. Because these tapes are available in rolls for all automatic or manual wafer mounting systems, thermal release tape is widely applied in semiconductor package industry. In this paper, heat-resistance of… CONTINUE READING

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